Newsroom

Hsinchu, Taiwan (Jul. 24, 2012)- Embedded non-volatile memory (eNVM) silicon IP leader eMemory announced today that its embedded Multiple Times Programmable (MTP) memory silicon IP, NeoEE, has already passed electrical verification on a global leading wafer fab’s 65nm process platform, and is expected to complete reliability verification by the end of 2012. eMemory’s 0.18um, 0.16um, and 0.11um NeoEE technology platforms have already passed verification at the primary wafer fabs of the Asia region, and will provide a more comprehensive layout of MTP eNVM silicon IPs with cost advantages that are expected to find application in SoC-related products such as Near Field Communication (NFC), 2.4GHz RFICs, RFID Tags, and Bluetooth Controller.

NeoEE is an embedded, non-volatile, high read-write cycle memory technology characterized by its simple and robust structure. NeoEE can be written or erased up to 10,000 to 100,000 times, and due to its complete compatibility with current logic processes, no extra masks are needed to integrate NeoEE into different types of process platforms, which translates into an extremely low cost for adoption by semiconductor foundries. NeoEE also has distinct advantages of low power consumption and competitive silicon IP layout area. NeoEE can provide functional blocks in two modes: EEPROM architecture or Flash architecture, and its primary function is application to consumer electronics, such as in storing pairing passwords needed by ICs, system execution-related settings data, and use status, etc. NeoEE is a perfect match for consumer electronics products needing embedded mid- to low-capacity storage with high reliability.

eMemory President, Rick Shen, remarked: “eMemory is the leader in embedded NVM technology and silicon IP industry, and has strong foundations and capability in memory device technology and circuit development. eMemory is familiar with memory component operating schemes and potential reliability problems that are likely to arise. In the face of customers expectations of pursuing high reliability and expecting low barriers to entry, eMemory uses industry-recognized, reliable component operating modes to mitigate oxide damage from harmful operations, so as to provide customers stable yield during mass production. In addition to One Time Programmable (OTP) memory silicon IP, NeoBit, which has received widespread praise and adoption by its customers, eMemory’s MTP memory silicon IPs, NeoFlash and NeoEE, are gradually coming to the fore in the market, with multiple alliance partners already strategizing cooperative roadmaps. Comprehensive eNVM technology roadmaps will provide customers optimal product planning, the most appropriate product specifications, and the broadest selection of manufacturing platforms. In the fiercely competitive electronics industry, chip designers will be in an even better position to strengthen product competitiveness. eMemory is currently providing preferential service to early adopters of NeoEE, and we welcome customers in any related application field to contact us for a more in-depth partnership discussions.”

eMemory’s eNVM silicon IP has already passed total output of 4 million customer wafers. With manufacturing platforms at 16 wafer fabs worldwide, eMemory’s eNVM silicon IP can be applied in over 400 types of electronic products, including consumer electronics, as well as industrial and automotive applications. Looking forward, eMemory will provide comprehensive eNVM technology and platform layouts, including advanced process OTP and high-capacity MTP eNVM, so that eMemory eNVM solutions can be built into all kinds of manufacturing platforms to provide customers of different fields with comprehensive low-level to high-level product lines.